About Us

The evolution of a Global Sensor Technology company

Founded in 1985, Interlink Electronics has grown from a force-sensing pioneer into a vertically integrated sensor technology and printed electronics company serving major OEMs across industrial, medical, consumer, automotive, wearables, IoT, and specialty markets. Our teams combine materials science, manufacturing, embedded electronics, firmware, software, and application engineering to help customers turn demanding sensing and interface requirements into manufacturable products with standard and custom solutions.

Founded

1985

Founded around patented Force Sensing Resistor technology and expanded into a broader sensing and printed-electronics platform.

IP Portfolio

49 + 14

49 issued patents and 14 additional patents pending across sensing, interfaces, and printed electronics.

Global Team

100+

Operating globally in the USA, UK, China, and Japan to support engineering, manufacturing, and customer programs.

Platform

Integrated

Design, manufacturing, engineering, embedded electronics, firmware, and software in one coordinated operating model.

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What We Do

A company built around practical invention and production-ready execution

Interlink began with patented Force Sensing Resistor technology and built a long operating history around human-machine interface sensing. Over time, the company expanded into position sensing, rugged pointing controls, gas sensing, printed electronics, smart textiles, membrane keypads, graphic overlays, and full custom-device programs.

That history matters because many customer programs need more than a catalog part. Interlink can support the sensing stack, electronics, mechanical package, shell and enclosure decisions, hardware integration, firmware, software, and the path to manufacturing readiness.

Why Interlink

Vertically integrated technology platform serving multiple high-growth verticals
Positioned as a critical supplier for the global sensor, AI, and data revolution
Trusted by major OEMs across industrial, medical, consumer, automotive, and smart-tech markets
Global operations supporting engineering, manufacturing, and customer programs

Technology Platforms

Interlink capabilities across the portfolio

Sensors

Force sensing solutions, position sensing, mouse pointing, HMI controls, and related custom sensor architectures.

Gas Sensors

Electrochemical sensor elements, modules, instruments, analyzers, and connected gas-sensing solutions.

Printed Electronics

Membrane keypads, graphic overlays, labels, printed heaters, diagnostic electrodes, and interface assemblies.

Smart Textiles & Wearables

Stretchable printed electronics, textile sensing, wearable heating, rehabilitation garments, and connected e-textile systems.

Interlink History

The company arc at a glance

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1985

Interlink is founded around Force Sensing Resistor technology

The company enters the market with a patented sensing platform that becomes foundational to its long-term position in human-machine interface technology.

2010–2011

Leadership aligns around platform growth

Interlink sharpens its operating strategy around scalable manufacturing, mission-critical technologies, and disciplined expansion.

2022–2024

Interlink expands across gas sensing, digital interfaces, and smart textiles

Targeted acquisitions broaden the business into electrochemical gas sensing, membrane keypads, printed electronics, and wearable textile technologies.

Global Footprint

Operations supporting customers across design, engineering, and manufacturing

Fremont, California

Corporate headquarters and leadership hub supporting strategy, customer engagement, and platform growth.

Irvine, Scotland

Manufacturing center supporting printed electronics, interfaces, and product industrialization.

Shenzhen, China

High-volume production and engineering support for global OEM programs and scalable manufacturing.

Yokohama, Japan

Sales and customer-support office strengthening regional coverage and application support.

Leadership

Senior management team

Executive Leadership

Steven N. Bronson

Chairman, President, and Chief Executive Officer

Steven N. Bronson has over 40 years of business and entrepreneurial experience spanning investment banking, operations, management, and corporate development.

He became Chairman and CEO of Interlink Electronics in 2010 and assumed the role of President in 2011. Since then, he has focused on strategic priorities, mission-critical decisions, and acquisition-led platform expansion.

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His leadership has helped shape Interlink into a vertically integrated technology platform serving sensing, printed electronics, and high-growth OEM markets.

Executive Leadership

Ryan J. Hoffman

Chief Financial Officer

Ryan J. Hoffman brings more than two decades of accounting, audit, and financial leadership experience to Interlink.

As CFO, he oversees financial strategy, reporting, capital planning, and corporate development support for the company’s operating platforms.

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Before joining Interlink, he spent 16 years at RSM, including five years as an audit partner, after earlier experience with Ernst & Young.

Executive Leadership

Declan Flannery

Vice President, Force Sensing Solutions

Declan Flannery has been a core member of the Interlink executive team for more than 15 years and leads Interlink’s force sensing platform.

With nearly 30 years of experience across international operations, sensor design and manufacturing, product management, and project delivery, he has been central to Interlink’s growth in printed electronics and force sensing.

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He also holds patents on force sensing technology and brings deep manufacturing and commercialization expertise to the business.

Executive Leadership

Sreenivasa (Sreeni) Rao

Vice President, Gas & Environmental Sensing Solutions

Sreeni Rao leads Interlink’s gas and environmental sensing solutions portfolio, helping align sensor elements, modules, instruments, and OEM programs across the broader gas platform.

Before joining Interlink, he held leadership roles across sensing and product strategy, including gas and environmental sensor work at TDK InvenSense and product management leadership at Qualtré.

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He holds a Ph.D. in Electronic and Computer Engineering from UC Irvine and an MBA from Northeastern University in Boston, Massachusetts, supporting growth across industrial, medical, environmental, consumer, and connected sensing markets.